Manufacture of truncated lenses, of pairs of truncated lenses and of corresponding devices

The invention relates to wafer-level manufacturing of optical devices such as modules comprising micro-lenses. In one aspect, passive optical components such as truncated lenses are manufactured by providing a substrate on which a multitude of precursor optical structures is present; and removing material from each of said multitude of precursor optical structures. Another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, said method comprising the steps of using a tool obtained by carrying out the steps of manufacturing a precursor tool having a replication surface; and modifying said replication surface by removing material from said precursor tool. An yet another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, wherein the method comprises the step of using a master comprising a replication surface comprising, for each of said passive optical components, a first portion describin