TWI636841B
Before bonding abrasive grain (13) to a core wire (11), a palladium coating (17) is applied to the surface of the abrasive grain (13). The palladium coating (17) is formed as a sea on the surface of the diamond grains (14). In other words, the palladium coating (17) covers the surface of the diamond...
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creator | MATSUNAGA, YOSHINORI TANAKA, NAOKI KUBOTA, TETSUJI |
description | Before bonding abrasive grain (13) to a core wire (11), a palladium coating (17) is applied to the surface of the abrasive grain (13). The palladium coating (17) is formed as a sea on the surface of the diamond grains (14). In other words, the palladium coating (17) covers the surface of the diamond grains (14) so that the entirety thereof is continuous. Moreover, the palladium coating (17) does not completely cover the diamond grains (14), and a diamond exposed portion (18) is provided by the palladium coating (17) not being applied on a portion thereof. The exposed diamond portion (18) is formed as an island on the surface of the abrasive grain (13). In other words, a plurality of diamond exposed portions (18) are formed as islands separated from each other. |
format | Patent |
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In other words, the palladium coating (17) covers the surface of the diamond grains (14) so that the entirety thereof is continuous. Moreover, the palladium coating (17) does not completely cover the diamond grains (14), and a diamond exposed portion (18) is provided by the palladium coating (17) not being applied on a portion thereof. The exposed diamond portion (18) is formed as an island on the surface of the abrasive grain (13). In other words, a plurality of diamond exposed portions (18) are formed as islands separated from each other.</description><language>chi</language><subject>BROACHING ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; FILING ; GRINDING ; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR ; MACHINE TOOLS ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PLANING ; POLISHING ; SAWING ; SCRAPING ; SHEARING ; SLOTTING ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181001&DB=EPODOC&CC=TW&NR=I636841B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181001&DB=EPODOC&CC=TW&NR=I636841B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUNAGA, YOSHINORI</creatorcontrib><creatorcontrib>TANAKA, NAOKI</creatorcontrib><creatorcontrib>KUBOTA, TETSUJI</creatorcontrib><title>TWI636841B</title><description>Before bonding abrasive grain (13) to a core wire (11), a palladium coating (17) is applied to the surface of the abrasive grain (13). The palladium coating (17) is formed as a sea on the surface of the diamond grains (14). In other words, the palladium coating (17) covers the surface of the diamond grains (14) so that the entirety thereof is continuous. Moreover, the palladium coating (17) does not completely cover the diamond grains (14), and a diamond exposed portion (18) is provided by the palladium coating (17) not being applied on a portion thereof. The exposed diamond portion (18) is formed as an island on the surface of the abrasive grain (13). In other words, a plurality of diamond exposed portions (18) are formed as islands separated from each other.</description><subject>BROACHING</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>FILING</subject><subject>GRINDING</subject><subject>LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR</subject><subject>MACHINE TOOLS</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PLANING</subject><subject>POLISHING</subject><subject>SAWING</subject><subject>SCRAPING</subject><subject>SHEARING</subject><subject>SLOTTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0MzazMDF04mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAC0EbhQ</recordid><startdate>20181001</startdate><enddate>20181001</enddate><creator>MATSUNAGA, YOSHINORI</creator><creator>TANAKA, NAOKI</creator><creator>KUBOTA, TETSUJI</creator><scope>EVB</scope></search><sort><creationdate>20181001</creationdate><title>TWI636841B</title><author>MATSUNAGA, YOSHINORI ; TANAKA, NAOKI ; KUBOTA, TETSUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI636841BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2018</creationdate><topic>BROACHING</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>FILING</topic><topic>GRINDING</topic><topic>LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR</topic><topic>MACHINE TOOLS</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PLANING</topic><topic>POLISHING</topic><topic>SAWING</topic><topic>SCRAPING</topic><topic>SHEARING</topic><topic>SLOTTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MATSUNAGA, YOSHINORI</creatorcontrib><creatorcontrib>TANAKA, NAOKI</creatorcontrib><creatorcontrib>KUBOTA, TETSUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATSUNAGA, YOSHINORI</au><au>TANAKA, NAOKI</au><au>KUBOTA, TETSUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI636841B</title><date>2018-10-01</date><risdate>2018</risdate><abstract>Before bonding abrasive grain (13) to a core wire (11), a palladium coating (17) is applied to the surface of the abrasive grain (13). The palladium coating (17) is formed as a sea on the surface of the diamond grains (14). In other words, the palladium coating (17) covers the surface of the diamond grains (14) so that the entirety thereof is continuous. Moreover, the palladium coating (17) does not completely cover the diamond grains (14), and a diamond exposed portion (18) is provided by the palladium coating (17) not being applied on a portion thereof. The exposed diamond portion (18) is formed as an island on the surface of the abrasive grain (13). In other words, a plurality of diamond exposed portions (18) are formed as islands separated from each other.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BROACHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FILING GRINDING LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR MACHINE TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PLANING POLISHING SAWING SCRAPING SHEARING SLOTTING TRANSPORTING |
title | TWI636841B |
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