Package structure and method for fabricating the same

A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing are...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG, CHUNG YAN, TSAI, YING CHOU, WANG, CHIEN HUI, TANG, SHAO TZU, YEH, JIA FONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!