TWI627248B
The invention relates to an adhesive composition, an adhesive film and a surface-protective adhesive film. The invention provides an adhesive composition, an adhesive film and a surface-protective adhesive film using the adhesive composition. The adhesive composition, the adhesive film and the surfa...
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creator | SHIMAGUCHI, RYUUSUKE NAGAKURA, TAKESHI |
description | The invention relates to an adhesive composition, an adhesive film and a surface-protective adhesive film. The invention provides an adhesive composition, an adhesive film and a surface-protective adhesive film using the adhesive composition. The adhesive composition, the adhesive film and the surface-protective adhesive film using the adhesive composition have excellent antistatic property, corrosion resistance, and low pollution. The adhesive composition is acrylic polymer which contains (meth)acrylate monomers with an alkyl carbon number of C1-C14 as main components, and comprises polyether compounds and ionic compounds with a melting point being more than 30 DEG C. The ionic compounds with a melting point being more than 30 DEG C are not alkali metal salts. |
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The adhesive composition, the adhesive film and the surface-protective adhesive film using the adhesive composition have excellent antistatic property, corrosion resistance, and low pollution. The adhesive composition is acrylic polymer which contains (meth)acrylate monomers with an alkyl carbon number of C1-C14 as main components, and comprises polyether compounds and ionic compounds with a melting point being more than 30 DEG C. 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The invention provides an adhesive composition, an adhesive film and a surface-protective adhesive film using the adhesive composition. The adhesive composition, the adhesive film and the surface-protective adhesive film using the adhesive composition have excellent antistatic property, corrosion resistance, and low pollution. The adhesive composition is acrylic polymer which contains (meth)acrylate monomers with an alkyl carbon number of C1-C14 as main components, and comprises polyether compounds and ionic compounds with a melting point being more than 30 DEG C. 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subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
title | TWI627248B |
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