TWI619430B

Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally conne...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOCHIGI, YASUYUKI, TSENG, HUNG WEI, CHU, KUANG YU, MEGURO, MASAHIRO, KAWABATA, KENYA
Format:	Patent
Sprache:	chi
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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