TWI619430B
Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally conne...
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| creator | TOCHIGI, YASUYUKI TSENG, HUNG WEI CHU, KUANG YU MEGURO, MASAHIRO KAWABATA, KENYA |
| description | Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other. |
| format | Patent |
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The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0M7Q0MTZw4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEACJobdg</recordid><startdate>20180321</startdate><enddate>20180321</enddate><creator>TOCHIGI, YASUYUKI</creator><creator>TSENG, HUNG WEI</creator><creator>CHU, KUANG YU</creator><creator>MEGURO, MASAHIRO</creator><creator>KAWABATA, KENYA</creator><scope>EVB</scope></search><sort><creationdate>20180321</creationdate><title>TWI619430B</title><author>TOCHIGI, YASUYUKI ; TSENG, HUNG WEI ; CHU, KUANG YU ; MEGURO, MASAHIRO ; KAWABATA, KENYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI619430BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>TOCHIGI, YASUYUKI</creatorcontrib><creatorcontrib>TSENG, HUNG WEI</creatorcontrib><creatorcontrib>CHU, KUANG YU</creatorcontrib><creatorcontrib>MEGURO, MASAHIRO</creatorcontrib><creatorcontrib>KAWABATA, KENYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOCHIGI, YASUYUKI</au><au>TSENG, HUNG WEI</au><au>CHU, KUANG YU</au><au>MEGURO, MASAHIRO</au><au>KAWABATA, KENYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI619430B</title><date>2018-03-21</date><risdate>2018</risdate><abstract>Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | TWI619430B |
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