Methods of surface interface engineering

Methods for surface interface engineering in semiconductor fabrication are provided herein. In some embodiments, a method of processing a substrate disposed atop a substrate support in a processing volume of a processing chamber includes: generating an ion species from an inductively coupled plasma...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HE, JIM ZHONGYI, HON, MELITTA MANYIN, YAN, CHUN, HUA, XUEFENG, HSIEH, PING HAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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