Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages

Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages

Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to ano...

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Hauptverfasser: KOFSTAD, HARVEY R, BOYD, THOMAS A, BOSAK, HENRY C
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator KOFSTAD, HARVEY R
BOYD, THOMAS A
BOSAK, HENRY C
description Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI603442BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI603442BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI603442BB3</originalsourceid><addsrcrecordid>eNqNyksKwjAURuFOHIi6h7uBgNji3Iqi84LDchv_NsGbB01acPdWcAGODnycddGdphwcZ6vJwA4mkw4uwqeF_EDsnwuoKOx5JMEM-bIBZxrhwsxCnBJcJ2_qw0hukmyVNjZSZP3iAWlbrHqWhN2vm4Kul-Z8U4ihRVo2eOS2edyP-7KqDnVd_rF8AAyqPmE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages</title><source>esp@cenet</source><creator>KOFSTAD, HARVEY R ; BOYD, THOMAS A ; BOSAK, HENRY C</creator><creatorcontrib>KOFSTAD, HARVEY R ; BOYD, THOMAS A ; BOSAK, HENRY C</creatorcontrib><description>Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20171021&amp;DB=EPODOC&amp;CC=TW&amp;NR=I603442B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20171021&amp;DB=EPODOC&amp;CC=TW&amp;NR=I603442B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOFSTAD, HARVEY R</creatorcontrib><creatorcontrib>BOYD, THOMAS A</creatorcontrib><creatorcontrib>BOSAK, HENRY C</creatorcontrib><title>Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages</title><description>Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyksKwjAURuFOHIi6h7uBgNji3Iqi84LDchv_NsGbB01acPdWcAGODnycddGdphwcZ6vJwA4mkw4uwqeF_EDsnwuoKOx5JMEM-bIBZxrhwsxCnBJcJ2_qw0hukmyVNjZSZP3iAWlbrHqWhN2vm4Kul-Z8U4ihRVo2eOS2edyP-7KqDnVd_rF8AAyqPmE</recordid><startdate>20171021</startdate><enddate>20171021</enddate><creator>KOFSTAD, HARVEY R</creator><creator>BOYD, THOMAS A</creator><creator>BOSAK, HENRY C</creator><scope>EVB</scope></search><sort><creationdate>20171021</creationdate><title>Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages</title><author>KOFSTAD, HARVEY R ; BOYD, THOMAS A ; BOSAK, HENRY C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI603442BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KOFSTAD, HARVEY R</creatorcontrib><creatorcontrib>BOYD, THOMAS A</creatorcontrib><creatorcontrib>BOSAK, HENRY C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOFSTAD, HARVEY R</au><au>BOYD, THOMAS A</au><au>BOSAK, HENRY C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages</title><date>2017-10-21</date><risdate>2017</risdate><abstract>Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T04%3A14%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KOFSTAD,%20HARVEY%20R&rft.date=2017-10-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI603442BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true