TWI599755B

A vapor chamber structure includes a main body, a fan and multiple perforations. The main body has a heat absorption section, a heat dissipation section and a chamber. The heat absorption section and the heat dissipation section are respectively horizontally disposed on left and right sides of the m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TSAI, TSUNG-HSIEN, HSIEH, KUOUN
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CALCULATING COMPUTING COUNTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING PHYSICS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	A vapor chamber structure includes a main body, a fan and multiple perforations. The main body has a heat absorption section, a heat dissipation section and a chamber. The heat absorption section and the heat dissipation section are respectively horizontally disposed on left and right sides of the main body. The heat absorption section is attached to at least one heat source. The chamber is positioned at the heat absorption section and partially extends to the heat dissipation section. The chamber has a capillary structure and at least one perforated section. The perforated section is connected between an upper side and a lower side of the chamber. The fan is disposed on one side of the heat dissipation section. The perforations are formed through the parts of the main body, which parts are free from the chamber and the parts of the main body, where the perforated section is disposed.