Method of manufacturing a semiconductor device

A method of manufacturing a semiconductor device includes laminating and forming an electron transit layer, an electron supplying layer, an etching stop layer, and a p-type film on a substrate sequentially, the p-type film being formed of a nitride semiconductor material that includes Al doped with...

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Bibliographische Detailangaben
Hauptverfasser: YAMADA, ATSUSHI, NUKUI, KENJI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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