TWI587959B

PROBLEM TO BE SOLVED: To provide a substrate processing method and a processing apparatus for concurrently processing an upside substrate and a downside substrate of a laminated substrate.SOLUTION: A substrate processing method for performing scribe groove processing by irradiating a laminated subst...

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Bibliographische Detailangaben

1. Verfasser:	NAKATANI, IKUYOSHI
Format:	Patent
Sprache:	chi
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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