Integrated circuit, wire-bonded package, flip-chip package, and mobile computing device

Techniques and structure are disclosed for enhancing fracture resistance of back-end interconnects and other such interconnect structures by increasing via density. Increased via density can be provided, for example, within the filler/dummified portion(s) of adjacent circuit layers within a die. In...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOBRINSKY, MAURO J, BHINGARDE, SIDDHARTH B, PANTUSO, DANIEL, JEZEWSKI, CHRISTOPHER J, O'DAY, MICHAEL P
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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