Method of manufacturing a photomask and photomask substrate
The present invention is provided to obtain a method for manufacturing a photomask capable of forming a translation pattern with high dimensional accuracy. The method for manufacturing the photomask comprises: a process of preparing a resist-attached photomask substrate in which an optical film, a r...
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creator | UMEDA, YOSHIHIRO |
description | The present invention is provided to obtain a method for manufacturing a photomask capable of forming a translation pattern with high dimensional accuracy. The method for manufacturing the photomask comprises: a process of preparing a resist-attached photomask substrate in which an optical film, a reflective thin film, and a resist film are layered on a transparent substrate; a process of forming a resist pattern; a thin film etching process of forming a pattern of the reflective thin film; a process of removing the resist pattern; a measuring process of measuring the size of the reflective thin film pattern; an optical film etching process of performing wet etching of the optical film, using the reflective thin film pattern as a mask, based on the etching time for the optical film which is determined according to the measured size; and a process of removing the reflective thin film. With respect to the measuring process, the size is measured by emitting an examination light onto a measurement unit of the ref |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI572976BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI572976BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI572976BB3</originalsourceid><addsrcrecordid>eNrjZLD2TS3JyE9RyE9TyE3MK01LTC4pLcrMS1dIVCjIyC_Jz00szlZIzEtB4hWXJhWXFCWWpPIwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUkviQcE9TcyNLczMnJ2MilAAAhBcv-w</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of manufacturing a photomask and photomask substrate</title><source>esp@cenet</source><creator>UMEDA, YOSHIHIRO</creator><creatorcontrib>UMEDA, YOSHIHIRO</creatorcontrib><description>The present invention is provided to obtain a method for manufacturing a photomask capable of forming a translation pattern with high dimensional accuracy. The method for manufacturing the photomask comprises: a process of preparing a resist-attached photomask substrate in which an optical film, a reflective thin film, and a resist film are layered on a transparent substrate; a process of forming a resist pattern; a thin film etching process of forming a pattern of the reflective thin film; a process of removing the resist pattern; a measuring process of measuring the size of the reflective thin film pattern; an optical film etching process of performing wet etching of the optical film, using the reflective thin film pattern as a mask, based on the etching time for the optical film which is determined according to the measured size; and a process of removing the reflective thin film. With respect to the measuring process, the size is measured by emitting an examination light onto a measurement unit of the ref</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170301&DB=EPODOC&CC=TW&NR=I572976B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170301&DB=EPODOC&CC=TW&NR=I572976B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UMEDA, YOSHIHIRO</creatorcontrib><title>Method of manufacturing a photomask and photomask substrate</title><description>The present invention is provided to obtain a method for manufacturing a photomask capable of forming a translation pattern with high dimensional accuracy. The method for manufacturing the photomask comprises: a process of preparing a resist-attached photomask substrate in which an optical film, a reflective thin film, and a resist film are layered on a transparent substrate; a process of forming a resist pattern; a thin film etching process of forming a pattern of the reflective thin film; a process of removing the resist pattern; a measuring process of measuring the size of the reflective thin film pattern; an optical film etching process of performing wet etching of the optical film, using the reflective thin film pattern as a mask, based on the etching time for the optical film which is determined according to the measured size; and a process of removing the reflective thin film. With respect to the measuring process, the size is measured by emitting an examination light onto a measurement unit of the ref</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD2TS3JyE9RyE9TyE3MK01LTC4pLcrMS1dIVCjIyC_Jz00szlZIzEtB4hWXJhWXFCWWpPIwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUkviQcE9TcyNLczMnJ2MilAAAhBcv-w</recordid><startdate>20170301</startdate><enddate>20170301</enddate><creator>UMEDA, YOSHIHIRO</creator><scope>EVB</scope></search><sort><creationdate>20170301</creationdate><title>Method of manufacturing a photomask and photomask substrate</title><author>UMEDA, YOSHIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI572976BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>UMEDA, YOSHIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UMEDA, YOSHIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of manufacturing a photomask and photomask substrate</title><date>2017-03-01</date><risdate>2017</risdate><abstract>The present invention is provided to obtain a method for manufacturing a photomask capable of forming a translation pattern with high dimensional accuracy. The method for manufacturing the photomask comprises: a process of preparing a resist-attached photomask substrate in which an optical film, a reflective thin film, and a resist film are layered on a transparent substrate; a process of forming a resist pattern; a thin film etching process of forming a pattern of the reflective thin film; a process of removing the resist pattern; a measuring process of measuring the size of the reflective thin film pattern; an optical film etching process of performing wet etching of the optical film, using the reflective thin film pattern as a mask, based on the etching time for the optical film which is determined according to the measured size; and a process of removing the reflective thin film. With respect to the measuring process, the size is measured by emitting an examination light onto a measurement unit of the ref</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
title | Method of manufacturing a photomask and photomask substrate |
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