TWI559399B

The present invention is a sacrificial-film removal method of removing a sacrificial film from a surface of a substrate provided with a plurality of struts and the sacrificial film embedded between the plurality of struts, including: a wet etching step where the sacrificial film is removed to its ha...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIKUCHI, AKIOU, OKUTANI, MANABU, UMEZAKI, TOMONORI
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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