TWI551384B

Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head (16) and a controller; the irradiation head (16) has a laser revolving unit (35) and a light collection optical sys...

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Bibliographische Detailangaben
Hauptverfasser: GOYA, SANEYUKI, WATANABE, TOSHIYA, YAMASAKI, MAKOTO, ISHIDE, TAKASHI, SUZUKI, RYU, KANAOKA, KOHEI, YAMASHITA, TSUGUMARU, FUJITA, YOSHIHITO, KINOUCHI, MASATO, DANNO, MINORU
Format: Patent
Sprache:chi
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