SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

A method for manufacturing semiconductor devices is provided. A protection layer is conformally deposited over a passivation layer such that the protection layer has a protrusion pattern that protrudes from a top surface of the protection layer. Further, a post-passivation interconnect structure (PP...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN, JIE, CHEN, HSIENWEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!