Semiconductor integrated circuit

A compound semiconductor integrated circuit chip has a front and/or back surface metal layer used for electrical connection to an external circuit. The compound semiconductor integrated circuit chip (first chip) comprises a substrate, an electronic device layer, and a dielectric layer. A first metal...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN, CHENG KUO, HUA, CHANG HWANG, HSIAO, HSIEN FU, TAKATANI, SHINICHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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