Laser processing apparatus

PROBLEM TO BE SOLVED: To provide a laser processing device, in particular, the laser processing device, which selectively performs laser processing only to a portion of a substrate where the laser processing is required.SOLUTION: A laser processing device includes: a laser generation part radiating...

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Bibliographische Detailangaben
Hauptverfasser:	NA, OK GYUN, LEE, KI UNG, SIM, HYUNG KI, CHOI, DONG KYU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laser processing device, in particular, the laser processing device, which selectively performs laser processing only to a portion of a substrate where the laser processing is required.SOLUTION: A laser processing device includes: a laser generation part radiating a laser beam; a reaction chamber where a substrate is placed; an optical part transmitting the laser beam radiated from the laser generation part into the reaction chamber; and a block part blocking the laser beam radiated from the laser generation part.