Method for fabricating an electronic device or component, and an anisotropic conductive film thereof, and a microcavity carrier belt or loop used therein
A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while co...
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| creator | AUNG, MAUNG KYAW CHANG, CHIAPU LIANG, RONGANG LEE, JIANNRONG SUN, YUHAO TSENG, CHIN-JEN ROKUTANDA, SHUJI |
| description | A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner. |
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In one embodiment, the position of the microcavities is varied in a controlled manner.</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; CONDUCTORS ; DYES ; ELECTRICITY ; INSULATORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160211&DB=EPODOC&CC=TW&NR=I521550B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160211&DB=EPODOC&CC=TW&NR=I521550B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AUNG, MAUNG KYAW</creatorcontrib><creatorcontrib>CHANG, CHIAPU</creatorcontrib><creatorcontrib>LIANG, RONGANG</creatorcontrib><creatorcontrib>LEE, JIANNRONG</creatorcontrib><creatorcontrib>SUN, YUHAO</creatorcontrib><creatorcontrib>TSENG, CHIN-JEN</creatorcontrib><creatorcontrib>ROKUTANDA, SHUJI</creatorcontrib><title>Method for fabricating an electronic device or component, and an anisotropic conductive film thereof, and a microcavity carrier belt or loop used therein</title><description>A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzDFOw0AQhWE3KVDCHeYAIBGQL2AEIgVdJMpoPfsWj7SeWa3HlnKU3BZHyQGoXvO9_6G5fMMHi5SsUgp9FQ4u-ktBCRns1VSYIhZh0GrYxmIK9aeVxCsLKpOtrqyOTePMLgsoSR7JB1RYulsahatxWMTPxKFWQaUe2a_hbFZonhBvJ9Fds0khT3i877ahz4_j-9czip0wlcBQ-On4c2hf92370nVv_yB_5LVSYQ</recordid><startdate>20160211</startdate><enddate>20160211</enddate><creator>AUNG, MAUNG KYAW</creator><creator>CHANG, CHIAPU</creator><creator>LIANG, RONGANG</creator><creator>LEE, JIANNRONG</creator><creator>SUN, YUHAO</creator><creator>TSENG, CHIN-JEN</creator><creator>ROKUTANDA, SHUJI</creator><scope>EVB</scope></search><sort><creationdate>20160211</creationdate><title>Method for fabricating an electronic device or component, and an anisotropic conductive film thereof, and a microcavity carrier belt or loop used therein</title><author>AUNG, MAUNG KYAW ; CHANG, CHIAPU ; LIANG, RONGANG ; LEE, JIANNRONG ; SUN, YUHAO ; TSENG, CHIN-JEN ; ROKUTANDA, SHUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI521550BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2016</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>AUNG, MAUNG KYAW</creatorcontrib><creatorcontrib>CHANG, CHIAPU</creatorcontrib><creatorcontrib>LIANG, RONGANG</creatorcontrib><creatorcontrib>LEE, JIANNRONG</creatorcontrib><creatorcontrib>SUN, YUHAO</creatorcontrib><creatorcontrib>TSENG, CHIN-JEN</creatorcontrib><creatorcontrib>ROKUTANDA, SHUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AUNG, MAUNG KYAW</au><au>CHANG, CHIAPU</au><au>LIANG, RONGANG</au><au>LEE, JIANNRONG</au><au>SUN, YUHAO</au><au>TSENG, CHIN-JEN</au><au>ROKUTANDA, SHUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for fabricating an electronic device or component, and an anisotropic conductive film thereof, and a microcavity carrier belt or loop used therein</title><date>2016-02-11</date><risdate>2016</risdate><abstract>A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES |
| title | Method for fabricating an electronic device or component, and an anisotropic conductive film thereof, and a microcavity carrier belt or loop used therein |
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