Semiconductor package integrated with conformal shield and antenna

A semiconductor package includes a substrate, a semiconductor die, a package body, an electromagnetic interference shield, a dielectric structure and an antenna element. The substrate comprises a grounding segment and a feeding point. The semiconductor die is disposed on the substrate. The package b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YEN, HAN CHI, LIAO, KUO HSIEN, YEH, YUNG YI, CHUNG, CHI SHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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