Interconnect structure and fabricating method thereof

Presented herein are an interconnect structure and method for forming the same. The interconnect structure includes a contact pad disposed over a substrate and a connector disposed over the substrate and spaced apart from the contact pad. A passivation layer is disposed over the contact pad and over...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN, HSIENWEI, LII, MIRNGJI, YU, CHENHUA, YU, TSUNGYUAN, TSAI, HAOYI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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