Method for manufacturing a led chip bonding body

Provided is a manufacturing method of an LED chip assembly wherein heat radiating properties have been significantly improved by mounting a heat spreader directly below an LED chip. The manufacturing method of the LED chip assembly is characterized in that, after mounting one or two or more LED chips on a metal-impregnated ceramic substrate or metal substrate wherein the substrate thickness is 0.1 to 2 mm and the surface roughness (Ra) is at most 0.5 µm, the metal-impregnated ceramic substrate or metal substrate is cut into a piece which includes the LED chip and is two to one hundred times the extent of the bottom area of the LED chip.