TWI488705B
Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic a...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MORI, KIMIAKI ANDOH, YOSHIYUKI SHIRAI, TAKESHI AIHARA, MASAMI UTSUNO, MASAYOSHI OKOCHI, TERUO SUKEKAWA, TAKUJI IKEDO, KENSHI SANJI, MASAKI NAKANISHI, KENSUKE YOSHIOKA, TAKAYASU WADA, RIE KUMAMOTO, SEISHI GOTOH, KAZUSHI IWAMURA, EIJI NAGASAKA, SHINSUKE NAKAMURA, ATSUO |
| description | Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI488705BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI488705BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI488705BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfc0sbAwNzB14mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEADWsbkQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI488705B</title><source>esp@cenet</source><creator>MORI, KIMIAKI ; ANDOH, YOSHIYUKI ; SHIRAI, TAKESHI ; AIHARA, MASAMI ; UTSUNO, MASAYOSHI ; OKOCHI, TERUO ; SUKEKAWA, TAKUJI ; IKEDO, KENSHI ; SANJI, MASAKI ; NAKANISHI, KENSUKE ; YOSHIOKA, TAKAYASU ; WADA, RIE ; KUMAMOTO, SEISHI ; GOTOH, KAZUSHI ; IWAMURA, EIJI ; NAGASAKA, SHINSUKE ; NAKAMURA, ATSUO</creator><creatorcontrib>MORI, KIMIAKI ; ANDOH, YOSHIYUKI ; SHIRAI, TAKESHI ; AIHARA, MASAMI ; UTSUNO, MASAYOSHI ; OKOCHI, TERUO ; SUKEKAWA, TAKUJI ; IKEDO, KENSHI ; SANJI, MASAKI ; NAKANISHI, KENSUKE ; YOSHIOKA, TAKAYASU ; WADA, RIE ; KUMAMOTO, SEISHI ; GOTOH, KAZUSHI ; IWAMURA, EIJI ; NAGASAKA, SHINSUKE ; NAKAMURA, ATSUO</creatorcontrib><description>Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).</description><language>chi</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150621&DB=EPODOC&CC=TW&NR=I488705B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150621&DB=EPODOC&CC=TW&NR=I488705B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORI, KIMIAKI</creatorcontrib><creatorcontrib>ANDOH, YOSHIYUKI</creatorcontrib><creatorcontrib>SHIRAI, TAKESHI</creatorcontrib><creatorcontrib>AIHARA, MASAMI</creatorcontrib><creatorcontrib>UTSUNO, MASAYOSHI</creatorcontrib><creatorcontrib>OKOCHI, TERUO</creatorcontrib><creatorcontrib>SUKEKAWA, TAKUJI</creatorcontrib><creatorcontrib>IKEDO, KENSHI</creatorcontrib><creatorcontrib>SANJI, MASAKI</creatorcontrib><creatorcontrib>NAKANISHI, KENSUKE</creatorcontrib><creatorcontrib>YOSHIOKA, TAKAYASU</creatorcontrib><creatorcontrib>WADA, RIE</creatorcontrib><creatorcontrib>KUMAMOTO, SEISHI</creatorcontrib><creatorcontrib>GOTOH, KAZUSHI</creatorcontrib><creatorcontrib>IWAMURA, EIJI</creatorcontrib><creatorcontrib>NAGASAKA, SHINSUKE</creatorcontrib><creatorcontrib>NAKAMURA, ATSUO</creatorcontrib><title>TWI488705B</title><description>Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0sbAwNzB14mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEADWsbkQ</recordid><startdate>20150621</startdate><enddate>20150621</enddate><creator>MORI, KIMIAKI</creator><creator>ANDOH, YOSHIYUKI</creator><creator>SHIRAI, TAKESHI</creator><creator>AIHARA, MASAMI</creator><creator>UTSUNO, MASAYOSHI</creator><creator>OKOCHI, TERUO</creator><creator>SUKEKAWA, TAKUJI</creator><creator>IKEDO, KENSHI</creator><creator>SANJI, MASAKI</creator><creator>NAKANISHI, KENSUKE</creator><creator>YOSHIOKA, TAKAYASU</creator><creator>WADA, RIE</creator><creator>KUMAMOTO, SEISHI</creator><creator>GOTOH, KAZUSHI</creator><creator>IWAMURA, EIJI</creator><creator>NAGASAKA, SHINSUKE</creator><creator>NAKAMURA, ATSUO</creator><scope>EVB</scope></search><sort><creationdate>20150621</creationdate><title>TWI488705B</title><author>MORI, KIMIAKI ; ANDOH, YOSHIYUKI ; SHIRAI, TAKESHI ; AIHARA, MASAMI ; UTSUNO, MASAYOSHI ; OKOCHI, TERUO ; SUKEKAWA, TAKUJI ; IKEDO, KENSHI ; SANJI, MASAKI ; NAKANISHI, KENSUKE ; YOSHIOKA, TAKAYASU ; WADA, RIE ; KUMAMOTO, SEISHI ; GOTOH, KAZUSHI ; IWAMURA, EIJI ; NAGASAKA, SHINSUKE ; NAKAMURA, ATSUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI488705BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2015</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>MORI, KIMIAKI</creatorcontrib><creatorcontrib>ANDOH, YOSHIYUKI</creatorcontrib><creatorcontrib>SHIRAI, TAKESHI</creatorcontrib><creatorcontrib>AIHARA, MASAMI</creatorcontrib><creatorcontrib>UTSUNO, MASAYOSHI</creatorcontrib><creatorcontrib>OKOCHI, TERUO</creatorcontrib><creatorcontrib>SUKEKAWA, TAKUJI</creatorcontrib><creatorcontrib>IKEDO, KENSHI</creatorcontrib><creatorcontrib>SANJI, MASAKI</creatorcontrib><creatorcontrib>NAKANISHI, KENSUKE</creatorcontrib><creatorcontrib>YOSHIOKA, TAKAYASU</creatorcontrib><creatorcontrib>WADA, RIE</creatorcontrib><creatorcontrib>KUMAMOTO, SEISHI</creatorcontrib><creatorcontrib>GOTOH, KAZUSHI</creatorcontrib><creatorcontrib>IWAMURA, EIJI</creatorcontrib><creatorcontrib>NAGASAKA, SHINSUKE</creatorcontrib><creatorcontrib>NAKAMURA, ATSUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORI, KIMIAKI</au><au>ANDOH, YOSHIYUKI</au><au>SHIRAI, TAKESHI</au><au>AIHARA, MASAMI</au><au>UTSUNO, MASAYOSHI</au><au>OKOCHI, TERUO</au><au>SUKEKAWA, TAKUJI</au><au>IKEDO, KENSHI</au><au>SANJI, MASAKI</au><au>NAKANISHI, KENSUKE</au><au>YOSHIOKA, TAKAYASU</au><au>WADA, RIE</au><au>KUMAMOTO, SEISHI</au><au>GOTOH, KAZUSHI</au><au>IWAMURA, EIJI</au><au>NAGASAKA, SHINSUKE</au><au>NAKAMURA, ATSUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI488705B</title><date>2015-06-21</date><risdate>2015</risdate><abstract>Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi |
| recordid | cdi_epo_espacenet_TWI488705BB |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | TWI488705B |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T18%3A26%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MORI,%20KIMIAKI&rft.date=2015-06-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI488705BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |