Led chip structure, led package substrate, led package structure and method of forming same

An LED package structure includes: a substrate having a die attach pad; a first insulating layer formed on the die attach pad and having a plurality of openings; an LED chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; a second i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANG, KUAN YU, WANG, JIH FU, WANG, YUEN HAN, CHEN, SHIEN WEN, LU, SHENG LI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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