Power semiconductor device having low gate input resistance and manufacturing method thereof
A power semiconductor device having low gate input resistance and a manufacturing method thereof are provided. The power semiconductor device includes a substrate, at least a trench transistor, a conductive layer, a metal contact plug, an insulating layer, an interlayer dielectric, a gate metal laye...
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creator | LIN, JIA FU YANG, GUO LIANG LIN, WEI CHIEH LIAO, SHIAN HAU |
description | A power semiconductor device having low gate input resistance and a manufacturing method thereof are provided. The power semiconductor device includes a substrate, at least a trench transistor, a conductive layer, a metal contact plug, an insulating layer, an interlayer dielectric, a gate metal layer, and a source metal layer. The metal contact plug can serve as a buried gate metal bus line, and the metal contact plug can pass under the source metal layer and keeps the area of the source metal layer complete. Accordingly, the present invention can provide a lower gate input resistance without dividing the source metal layer, so the source metal layer can have a larger and complete area for the following packaging and bonding process. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI438901BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI438901BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI438901BB3</originalsourceid><addsrcrecordid>eNqNyrEKwjAQBuAuDqK-w72AoNRB14qim0PBRShH8rcNNJeSXNrXV8EHcPqWb1m8HmFGpATvTBCbjYZIFpMzoJ4nJx0NYaaOFeRkzEoRySVl-QQWS54lt2w0x-_10D5Y0h4RoV0Xi5aHhM3PVUHXS32-bTGGBmlkA4E29fN-KI-n3b6qyj_KG6cUPKE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Power semiconductor device having low gate input resistance and manufacturing method thereof</title><source>esp@cenet</source><creator>LIN, JIA FU ; YANG, GUO LIANG ; LIN, WEI CHIEH ; LIAO, SHIAN HAU</creator><creatorcontrib>LIN, JIA FU ; YANG, GUO LIANG ; LIN, WEI CHIEH ; LIAO, SHIAN HAU</creatorcontrib><description>A power semiconductor device having low gate input resistance and a manufacturing method thereof are provided. The power semiconductor device includes a substrate, at least a trench transistor, a conductive layer, a metal contact plug, an insulating layer, an interlayer dielectric, a gate metal layer, and a source metal layer. The metal contact plug can serve as a buried gate metal bus line, and the metal contact plug can pass under the source metal layer and keeps the area of the source metal layer complete. Accordingly, the present invention can provide a lower gate input resistance without dividing the source metal layer, so the source metal layer can have a larger and complete area for the following packaging and bonding process.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140521&DB=EPODOC&CC=TW&NR=I438901B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140521&DB=EPODOC&CC=TW&NR=I438901B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN, JIA FU</creatorcontrib><creatorcontrib>YANG, GUO LIANG</creatorcontrib><creatorcontrib>LIN, WEI CHIEH</creatorcontrib><creatorcontrib>LIAO, SHIAN HAU</creatorcontrib><title>Power semiconductor device having low gate input resistance and manufacturing method thereof</title><description>A power semiconductor device having low gate input resistance and a manufacturing method thereof are provided. The power semiconductor device includes a substrate, at least a trench transistor, a conductive layer, a metal contact plug, an insulating layer, an interlayer dielectric, a gate metal layer, and a source metal layer. The metal contact plug can serve as a buried gate metal bus line, and the metal contact plug can pass under the source metal layer and keeps the area of the source metal layer complete. Accordingly, the present invention can provide a lower gate input resistance without dividing the source metal layer, so the source metal layer can have a larger and complete area for the following packaging and bonding process.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQBuAuDqK-w72AoNRB14qim0PBRShH8rcNNJeSXNrXV8EHcPqWb1m8HmFGpATvTBCbjYZIFpMzoJ4nJx0NYaaOFeRkzEoRySVl-QQWS54lt2w0x-_10D5Y0h4RoV0Xi5aHhM3PVUHXS32-bTGGBmlkA4E29fN-KI-n3b6qyj_KG6cUPKE</recordid><startdate>20140521</startdate><enddate>20140521</enddate><creator>LIN, JIA FU</creator><creator>YANG, GUO LIANG</creator><creator>LIN, WEI CHIEH</creator><creator>LIAO, SHIAN HAU</creator><scope>EVB</scope></search><sort><creationdate>20140521</creationdate><title>Power semiconductor device having low gate input resistance and manufacturing method thereof</title><author>LIN, JIA FU ; YANG, GUO LIANG ; LIN, WEI CHIEH ; LIAO, SHIAN HAU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI438901BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN, JIA FU</creatorcontrib><creatorcontrib>YANG, GUO LIANG</creatorcontrib><creatorcontrib>LIN, WEI CHIEH</creatorcontrib><creatorcontrib>LIAO, SHIAN HAU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN, JIA FU</au><au>YANG, GUO LIANG</au><au>LIN, WEI CHIEH</au><au>LIAO, SHIAN HAU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Power semiconductor device having low gate input resistance and manufacturing method thereof</title><date>2014-05-21</date><risdate>2014</risdate><abstract>A power semiconductor device having low gate input resistance and a manufacturing method thereof are provided. The power semiconductor device includes a substrate, at least a trench transistor, a conductive layer, a metal contact plug, an insulating layer, an interlayer dielectric, a gate metal layer, and a source metal layer. The metal contact plug can serve as a buried gate metal bus line, and the metal contact plug can pass under the source metal layer and keeps the area of the source metal layer complete. Accordingly, the present invention can provide a lower gate input resistance without dividing the source metal layer, so the source metal layer can have a larger and complete area for the following packaging and bonding process.</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Power semiconductor device having low gate input resistance and manufacturing method thereof |
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