SYSTEM AND METHOD FOR IN SITU MONITORING OF TOP WAFER THICKNESS IN A STACK OF WAFERS

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Hauptverfasser: SCHRAUB, FREDERIC ANTHONY, VOGTMANN, MICHAEL R, SMEDLEY, BENJAMIN C
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Sprache:chi ; eng
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VOGTMANN, MICHAEL R
SMEDLEY, BENJAMIN C
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI408760BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI408760BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI408760BB3</originalsourceid><addsrcrecordid>eNqNykEKwjAQRuFsXIh6h_8CQkFRt2mamKE0kcyU4qoUiSvRQr0_UvEArt7ifUslfGWxDXSo0FjxsYKLCRTAJC2aGEhionBGdJB4QaedTRBPpg6WeZYaLNrUs_heXqvFfXhMefPrSsFZMX6bx1efp3G45Wd-99LRvjgdD0VZ7v4gH7BXL80</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEM AND METHOD FOR IN SITU MONITORING OF TOP WAFER THICKNESS IN A STACK OF WAFERS</title><source>esp@cenet</source><creator>SCHRAUB, FREDERIC ANTHONY ; VOGTMANN, MICHAEL R ; SMEDLEY, BENJAMIN C</creator><creatorcontrib>SCHRAUB, FREDERIC ANTHONY ; VOGTMANN, MICHAEL R ; SMEDLEY, BENJAMIN C</creatorcontrib><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130911&amp;DB=EPODOC&amp;CC=TW&amp;NR=I408760B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130911&amp;DB=EPODOC&amp;CC=TW&amp;NR=I408760B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHRAUB, FREDERIC ANTHONY</creatorcontrib><creatorcontrib>VOGTMANN, MICHAEL R</creatorcontrib><creatorcontrib>SMEDLEY, BENJAMIN C</creatorcontrib><title>SYSTEM AND METHOD FOR IN SITU MONITORING OF TOP WAFER THICKNESS IN A STACK OF WAFERS</title><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNykEKwjAQRuFsXIh6h_8CQkFRt2mamKE0kcyU4qoUiSvRQr0_UvEArt7ifUslfGWxDXSo0FjxsYKLCRTAJC2aGEhionBGdJB4QaedTRBPpg6WeZYaLNrUs_heXqvFfXhMefPrSsFZMX6bx1efp3G45Wd-99LRvjgdD0VZ7v4gH7BXL80</recordid><startdate>20130911</startdate><enddate>20130911</enddate><creator>SCHRAUB, FREDERIC ANTHONY</creator><creator>VOGTMANN, MICHAEL R</creator><creator>SMEDLEY, BENJAMIN C</creator><scope>EVB</scope></search><sort><creationdate>20130911</creationdate><title>SYSTEM AND METHOD FOR IN SITU MONITORING OF TOP WAFER THICKNESS IN A STACK OF WAFERS</title><author>SCHRAUB, FREDERIC ANTHONY ; VOGTMANN, MICHAEL R ; SMEDLEY, BENJAMIN C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI408760BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHRAUB, FREDERIC ANTHONY</creatorcontrib><creatorcontrib>VOGTMANN, MICHAEL R</creatorcontrib><creatorcontrib>SMEDLEY, BENJAMIN C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHRAUB, FREDERIC ANTHONY</au><au>VOGTMANN, MICHAEL R</au><au>SMEDLEY, BENJAMIN C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM AND METHOD FOR IN SITU MONITORING OF TOP WAFER THICKNESS IN A STACK OF WAFERS</title><date>2013-09-11</date><risdate>2013</risdate><oa>free_for_read</oa></addata></record>
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language chi ; eng
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source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title SYSTEM AND METHOD FOR IN SITU MONITORING OF TOP WAFER THICKNESS IN A STACK OF WAFERS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-15T19%3A53%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SCHRAUB,%20FREDERIC%20ANTHONY&rft.date=2013-09-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI408760BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true