Method for packaging electronic tag and packaged structure thereof

A method for packaging an electronic tag is disclosed. The method for packaging an electronic tag includes steps of providing a substrate, forming a fist high molecular resin layer on the substrate, forming an electronic tag structure on the fist high molecular resin layer, forming a second high mol...

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Hauptverfasser:	FU, I JU, CHIANG, HSUEH MING, LO, YUNG CHIH, HONG, TIM, TSAI, PEI SHEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES
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creator	FU, I JU CHIANG, HSUEH MING LO, YUNG CHIH HONG, TIM TSAI, PEI SHEN
description	A method for packaging an electronic tag is disclosed. The method for packaging an electronic tag includes steps of providing a substrate, forming a fist high molecular resin layer on the substrate, forming an electronic tag structure on the fist high molecular resin layer, forming a second high molecular resin layer on the electronic tag structure and the fist high molecular resin layer, and impregnating a fiber material in the second high molecular resin layer. The packaged electronic tag can sustain bending and washing, and can be sewed in clean clothes for personnel control of the clean room.
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subjects	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES
title	Method for packaging electronic tag and packaged structure thereof
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