Diffusion bonded integrated fluid delivery system for semiconductor processing apparatus
A method of increasing the etchability of metals which have a microstructure which is resistant to chemical etching (such as HASTELLOY C-22). This is accomplished by temporarily removing the microstructure which provides corrosion resistance to the metal. The microstructure is removed by heat treati...
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| creator | KHULLAR, ANEESH LANE, JOHN W MOHAMMED, BALARABE N CROCKETT, MARK PORRAS, ERICA R DECHELLIS, MICHAEL J MELCER, CHRIS |
| description | A method of increasing the etchability of metals which have a microstructure which is resistant to chemical etching (such as HASTELLOY C-22). This is accomplished by temporarily removing the microstructure which provides corrosion resistance to the metal. The microstructure is removed by heat treating the metal. Following chemical etching, the microstructure is returned to its original corrosion resistance by heat treatment. |
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Following chemical etching, the microstructure is returned to its original corrosion resistance by heat treatment.</description><language>chi ; eng</language><subject>ACTUATING-FLOATS ; BLASTING ; COCKS ; DEVICES FOR VENTING OR AERATING ; ENGINEERING ELEMENTS AND UNITS ; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; TAPS ; THERMAL INSULATION IN GENERAL ; TRANSPORTING ; VALVES ; WEAPONS</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100911&DB=EPODOC&CC=TW&NR=I330167B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100911&DB=EPODOC&CC=TW&NR=I330167B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KHULLAR, ANEESH</creatorcontrib><creatorcontrib>LANE, JOHN W</creatorcontrib><creatorcontrib>MOHAMMED, BALARABE N</creatorcontrib><creatorcontrib>CROCKETT, MARK</creatorcontrib><creatorcontrib>PORRAS, ERICA R</creatorcontrib><creatorcontrib>DECHELLIS, MICHAEL J</creatorcontrib><creatorcontrib>MELCER, CHRIS</creatorcontrib><title>Diffusion bonded integrated fluid delivery system for semiconductor processing apparatus</title><description>A method of increasing the etchability of metals which have a microstructure which is resistant to chemical etching (such as HASTELLOY C-22). 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This is accomplished by temporarily removing the microstructure which provides corrosion resistance to the metal. The microstructure is removed by heat treating the metal. Following chemical etching, the microstructure is returned to its original corrosion resistance by heat treatment.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ACTUATING-FLOATS BLASTING COCKS DEVICES FOR VENTING OR AERATING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MECHANICAL ENGINEERING MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS TAPS THERMAL INSULATION IN GENERAL TRANSPORTING VALVES WEAPONS |
| title | Diffusion bonded integrated fluid delivery system for semiconductor processing apparatus |
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