Method of determining deposition temperature
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creator | WU, TSUNGIN KOU-YOW TSENG HONG, TIAN JUE LIEN, WENNG CHOU, SHIH LIANG LIN, TSUNG DE |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI307921BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI307921BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI307921BB3</originalsourceid><addsrcrecordid>eNrjZNDxTS3JyE9RyE9TSEktSS3KzczLzEsHsgvyizNLMvPzFEpScwtSixJLSotSeRhY0xJzilN5oTQ3g4Kba4izhy5QdXxqcUFicmpeakl8SLinsYG5pZGhk5MxEUoAf8oqYQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of determining deposition temperature</title><source>esp@cenet</source><creator>WU, TSUNGIN ; KOU-YOW TSENG ; HONG, TIAN JUE ; LIEN, WENNG ; CHOU, SHIH LIANG ; LIN, TSUNG DE</creator><creatorcontrib>WU, TSUNGIN ; KOU-YOW TSENG ; HONG, TIAN JUE ; LIEN, WENNG ; CHOU, SHIH LIANG ; LIN, TSUNG DE</creatorcontrib><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090321&DB=EPODOC&CC=TW&NR=I307921B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090321&DB=EPODOC&CC=TW&NR=I307921B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WU, TSUNGIN</creatorcontrib><creatorcontrib>KOU-YOW TSENG</creatorcontrib><creatorcontrib>HONG, TIAN JUE</creatorcontrib><creatorcontrib>LIEN, WENNG</creatorcontrib><creatorcontrib>CHOU, SHIH LIANG</creatorcontrib><creatorcontrib>LIN, TSUNG DE</creatorcontrib><title>Method of determining deposition temperature</title><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDxTS3JyE9RyE9TSEktSS3KzczLzEsHsgvyizNLMvPzFEpScwtSixJLSotSeRhY0xJzilN5oTQ3g4Kba4izhy5QdXxqcUFicmpeakl8SLinsYG5pZGhk5MxEUoAf8oqYQ</recordid><startdate>20090321</startdate><enddate>20090321</enddate><creator>WU, TSUNGIN</creator><creator>KOU-YOW TSENG</creator><creator>HONG, TIAN JUE</creator><creator>LIEN, WENNG</creator><creator>CHOU, SHIH LIANG</creator><creator>LIN, TSUNG DE</creator><scope>EVB</scope></search><sort><creationdate>20090321</creationdate><title>Method of determining deposition temperature</title><author>WU, TSUNGIN ; KOU-YOW TSENG ; HONG, TIAN JUE ; LIEN, WENNG ; CHOU, SHIH LIANG ; LIN, TSUNG DE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI307921BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>WU, TSUNGIN</creatorcontrib><creatorcontrib>KOU-YOW TSENG</creatorcontrib><creatorcontrib>HONG, TIAN JUE</creatorcontrib><creatorcontrib>LIEN, WENNG</creatorcontrib><creatorcontrib>CHOU, SHIH LIANG</creatorcontrib><creatorcontrib>LIN, TSUNG DE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WU, TSUNGIN</au><au>KOU-YOW TSENG</au><au>HONG, TIAN JUE</au><au>LIEN, WENNG</au><au>CHOU, SHIH LIANG</au><au>LIN, TSUNG DE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of determining deposition temperature</title><date>2009-03-21</date><risdate>2009</risdate><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | Method of determining deposition temperature |
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