Method and apparatus for microstructure assembly

A method for microstructure assembly is disclosed, which comprises steps of: providing a carrier having a plurality of joint formed thereon; forming a pedestal on each joint; forming a droplet on each pedestal; placing a microstructure on each droplet; removing each droplet for enabling the corresponding microstructure to couple with the joint corresponding thereto. In the aforesaid method, the use of the plural droplets is to align the plural microstructures in an automatic manner so as to enable each microstructure to couple with its corresponding joint smoothly. In a preferred aspect, an apparatus for microstructure assembly can be provided with respect to the aforesaid method, which is capable of automating the process of microstructure alignment and assembly.