Photocuring/thermosetting ink jet composition and printed wiring board using same
A photocuring/thermosetting inkjet composition contains (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in the molecule, (B) a photoreactive diluent other than the component (A) having a weight-average molecular weight of not more than 700, and (C) a photopolymerizat...
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| creator | USHIKI, SHIGERU KAKINUMA, MASAHISA KUSAMA, MASATOSHI |
| description | A photocuring/thermosetting inkjet composition contains (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in the molecule, (B) a photoreactive diluent other than the component (A) having a weight-average molecular weight of not more than 700, and (C) a photopolymerization initiator, and has a viscosity of not more than 150 mPa.s at 25 DEG C. A solder resist pattern is directly drawn on a printed wiring board by an inkjet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy beam and then further cured by heat. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI288142BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI288142BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI288142BB3</originalsourceid><addsrcrecordid>eNrjZAgMyMgvyU8uLcrMS9cvyUgtys0vTi0pAfIUMvOyFbJSSxSS83ML8oszSzLz8xQS81IUCoBqS1JTFMozQZoUkvITi1IUSotB7OLE3FQeBta0xJziVF4ozc2g4OYa4uyhm1qQH59aXJCYnJqXWhIfEu5pZGFhaGLk5GRMhBIA7b04iA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Photocuring/thermosetting ink jet composition and printed wiring board using same</title><source>esp@cenet</source><creator>USHIKI, SHIGERU ; KAKINUMA, MASAHISA ; KUSAMA, MASATOSHI</creator><creatorcontrib>USHIKI, SHIGERU ; KAKINUMA, MASAHISA ; KUSAMA, MASATOSHI</creatorcontrib><description>A photocuring/thermosetting inkjet composition contains (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in the molecule, (B) a photoreactive diluent other than the component (A) having a weight-average molecular weight of not more than 700, and (C) a photopolymerization initiator, and has a viscosity of not more than 150 mPa.s at 25 DEG C. A solder resist pattern is directly drawn on a printed wiring board by an inkjet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy beam and then further cured by heat.</description><language>eng</language><subject>ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COLOUR PRINTING ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; LINING MACHINES ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PERFORMING OPERATIONS ; POLISHES ; PRINTED CIRCUITS ; PRINTING ; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES ; STAMPS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; TYPEWRITERS ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071011&DB=EPODOC&CC=TW&NR=I288142B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071011&DB=EPODOC&CC=TW&NR=I288142B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>USHIKI, SHIGERU</creatorcontrib><creatorcontrib>KAKINUMA, MASAHISA</creatorcontrib><creatorcontrib>KUSAMA, MASATOSHI</creatorcontrib><title>Photocuring/thermosetting ink jet composition and printed wiring board using same</title><description>A photocuring/thermosetting inkjet composition contains (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in the molecule, (B) a photoreactive diluent other than the component (A) having a weight-average molecular weight of not more than 700, and (C) a photopolymerization initiator, and has a viscosity of not more than 150 mPa.s at 25 DEG C. A solder resist pattern is directly drawn on a printed wiring board by an inkjet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy beam and then further cured by heat.</description><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COLOUR PRINTING</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>LINING MACHINES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>PRINTING</subject><subject>PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES</subject><subject>STAMPS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgMyMgvyU8uLcrMS9cvyUgtys0vTi0pAfIUMvOyFbJSSxSS83ML8oszSzLz8xQS81IUCoBqS1JTFMozQZoUkvITi1IUSotB7OLE3FQeBta0xJziVF4ozc2g4OYa4uyhm1qQH59aXJCYnJqXWhIfEu5pZGFhaGLk5GRMhBIA7b04iA</recordid><startdate>20071011</startdate><enddate>20071011</enddate><creator>USHIKI, SHIGERU</creator><creator>KAKINUMA, MASAHISA</creator><creator>KUSAMA, MASATOSHI</creator><scope>EVB</scope></search><sort><creationdate>20071011</creationdate><title>Photocuring/thermosetting ink jet composition and printed wiring board using same</title><author>USHIKI, SHIGERU ; KAKINUMA, MASAHISA ; KUSAMA, MASATOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI288142BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COLOUR PRINTING</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>LINING MACHINES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>PRINTING</topic><topic>PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES</topic><topic>STAMPS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>USHIKI, SHIGERU</creatorcontrib><creatorcontrib>KAKINUMA, MASAHISA</creatorcontrib><creatorcontrib>KUSAMA, MASATOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>USHIKI, SHIGERU</au><au>KAKINUMA, MASAHISA</au><au>KUSAMA, MASATOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photocuring/thermosetting ink jet composition and printed wiring board using same</title><date>2007-10-11</date><risdate>2007</risdate><abstract>A photocuring/thermosetting inkjet composition contains (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in the molecule, (B) a photoreactive diluent other than the component (A) having a weight-average molecular weight of not more than 700, and (C) a photopolymerization initiator, and has a viscosity of not more than 150 mPa.s at 25 DEG C. A solder resist pattern is directly drawn on a printed wiring board by an inkjet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy beam and then further cured by heat.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COLOUR PRINTING COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS LINING MACHINES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS PRINTING PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES STAMPS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING TYPEWRITERS USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Photocuring/thermosetting ink jet composition and printed wiring board using same |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T20%3A09%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=USHIKI,%20SHIGERU&rft.date=2007-10-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI288142BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |