Method for measuring the bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a boned substrate

In a method for measuring the bonding quality of bonded substrates, such as bonded SOI wafers, a plurality of marks are created at a first side of a top substrate after, or before, the bonding of the top substrate onto a bottom substrate. Then, the positions of the plurality of marks are measured us...

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Bibliographische Detailangaben

Hauptverfasser:	FRIZ, ALEXANDER, BEST, KEITH FRANK, CONSOLINI, JOSEPH J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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