Front-sucking type wafer-capturing arm

The present invention provides a front-sucking type wafer-capturing arm, which is applied in a transporting equipment of semiconductor wafer, wherein the principle of vacuum sucking and air-inlet pressure control is utilized to achieve the function of sucking wafer with no contact. Also, the chamber...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG, WEI-JENG, YOU, CHIN-HUNG, HUNG, JIAN-JUNG, CHEN, ?SHIAN-JUNG, LIANN, FWU-REN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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