Mold cleaning apparatus

Mold cleaning apparatus (1) includes a manifold (5) adapted to be coupled to a suction device. A first conduit (6) extends from the manifold (5) and has a first opening (8) remote from the manifold. A second conduit (7) extends from the manifold (5) and has a second opening (11) remote from the mani...

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Bibliographische Detailangaben
Hauptverfasser:	LIU, JIE, HUANG, ZHEN-RONG, HO, SHUUEN, ONG, CHIN-GUAN, KUAH, TENG-HOCK
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Mold cleaning apparatus (1) includes a manifold (5) adapted to be coupled to a suction device. A first conduit (6) extends from the manifold (5) and has a first opening (8) remote from the manifold. A second conduit (7) extends from the manifold (5) and has a second opening (11) remote from the manifold (5). The first and the second openings (8, 11) being directed in opposite directions, and the first conduit (6) having a section (10) with a cross-sectional area which is less than cross-sectional area at any point along the length of the second conduit (7).