Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display wherein use is made of the surface-treated copper foil

To provide a surface-treated copper foil having excellent gray color and workable in a regular copper etching process, and a conductive mesh for PDP manufactured by the surface-treated copper foil. In the surface-treated copper foil having a grayish-treated surface on one side, a cobalt sulfide plat...

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creator HIGUCHI, TSUTOMU
description To provide a surface-treated copper foil having excellent gray color and workable in a regular copper etching process, and a conductive mesh for PDP manufactured by the surface-treated copper foil. In the surface-treated copper foil having a grayish-treated surface on one side, a cobalt sulfide plated layer is provided on a coarse surface of a copper foil layer, and a surface-treated copper foil or the like having the grayish-treated surface having a rustproof layer is employed. The surface-treated copper foil is manufactured by performing electrolysis at the predetermined current density by using cobalt plating liquid containing cobalt sulfide (7-hydrate) to form the rustproof layer on the coarse surface of an electrolytic copper foil or the like, and a method for water-rinsing and drying the rustproof layer is employed.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI280079BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI280079BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI280079BB3</originalsourceid><addsrcrecordid>eNqNj01KA0EQhWeThUTvUAcwEHShbiNKXBvIMhTdr6cb-o-qnoQcNndJT3QruKpHve_Vz91w-Z7EscGqCbjBkim1QsiVEMnzMeSRRuFzd_SHfKQqxUC1MzJrO5mZah6knECcLSHCNCmJx4wWDJ342F0fEO3MmpJ7qoXeTFB_m-Sk5EaVMyIVRzWyJiYbtKsznTwEIdOkoKCU2GKmbkv__uB-WDiOioffuhzo82P3vl2hlgO09li_77Dbfz29rtcvb5vN8z-QK8q5bFE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display wherein use is made of the surface-treated copper foil</title><source>esp@cenet</source><creator>HIGUCHI, TSUTOMU</creator><creatorcontrib>HIGUCHI, TSUTOMU</creatorcontrib><description>To provide a surface-treated copper foil having excellent gray color and workable in a regular copper etching process, and a conductive mesh for PDP manufactured by the surface-treated copper foil. In the surface-treated copper foil having a grayish-treated surface on one side, a cobalt sulfide plated layer is provided on a coarse surface of a copper foil layer, and a surface-treated copper foil or the like having the grayish-treated surface having a rustproof layer is employed. The surface-treated copper foil is manufactured by performing electrolysis at the predetermined current density by using cobalt plating liquid containing cobalt sulfide (7-hydrate) to form the rustproof layer on the coarse surface of an electrolytic copper foil or the like, and a method for water-rinsing and drying the rustproof layer is employed.</description><language>eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070421&amp;DB=EPODOC&amp;CC=TW&amp;NR=I280079B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070421&amp;DB=EPODOC&amp;CC=TW&amp;NR=I280079B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIGUCHI, TSUTOMU</creatorcontrib><title>Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display wherein use is made of the surface-treated copper foil</title><description>To provide a surface-treated copper foil having excellent gray color and workable in a regular copper etching process, and a conductive mesh for PDP manufactured by the surface-treated copper foil. In the surface-treated copper foil having a grayish-treated surface on one side, a cobalt sulfide plated layer is provided on a coarse surface of a copper foil layer, and a surface-treated copper foil or the like having the grayish-treated surface having a rustproof layer is employed. The surface-treated copper foil is manufactured by performing electrolysis at the predetermined current density by using cobalt plating liquid containing cobalt sulfide (7-hydrate) to form the rustproof layer on the coarse surface of an electrolytic copper foil or the like, and a method for water-rinsing and drying the rustproof layer is employed.</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNj01KA0EQhWeThUTvUAcwEHShbiNKXBvIMhTdr6cb-o-qnoQcNndJT3QruKpHve_Vz91w-Z7EscGqCbjBkim1QsiVEMnzMeSRRuFzd_SHfKQqxUC1MzJrO5mZah6knECcLSHCNCmJx4wWDJ342F0fEO3MmpJ7qoXeTFB_m-Sk5EaVMyIVRzWyJiYbtKsznTwEIdOkoKCU2GKmbkv__uB-WDiOioffuhzo82P3vl2hlgO09li_77Dbfz29rtcvb5vN8z-QK8q5bFE</recordid><startdate>20070421</startdate><enddate>20070421</enddate><creator>HIGUCHI, TSUTOMU</creator><scope>EVB</scope></search><sort><creationdate>20070421</creationdate><title>Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display wherein use is made of the surface-treated copper foil</title><author>HIGUCHI, TSUTOMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI280079BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HIGUCHI, TSUTOMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIGUCHI, TSUTOMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display wherein use is made of the surface-treated copper foil</title><date>2007-04-21</date><risdate>2007</risdate><abstract>To provide a surface-treated copper foil having excellent gray color and workable in a regular copper etching process, and a conductive mesh for PDP manufactured by the surface-treated copper foil. In the surface-treated copper foil having a grayish-treated surface on one side, a cobalt sulfide plated layer is provided on a coarse surface of a copper foil layer, and a surface-treated copper foil or the like having the grayish-treated surface having a rustproof layer is employed. The surface-treated copper foil is manufactured by performing electrolysis at the predetermined current density by using cobalt plating liquid containing cobalt sulfide (7-hydrate) to form the rustproof layer on the coarse surface of an electrolytic copper foil or the like, and a method for water-rinsing and drying the rustproof layer is employed.</abstract><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PERFORMING OPERATIONS
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TRANSPORTING
title Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display wherein use is made of the surface-treated copper foil
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T17%3A29%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HIGUCHI,%20TSUTOMU&rft.date=2007-04-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI280079BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true