Wafer transfer apparatus and transfer method

The purpose of the invention is to provide a wafer transfer apparatus and a method which can reduce a stress to a wafer, realizes simplification of the apparatus, and the temperature variation of the wafer is little. The wafer transfer apparatus is equipped with heat stages 20, 21, 22 on upper surfa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KOMACHI, YASUYUKI, MOROE, HIROBUMI
Format: Patent
Sprache:eng
Schlagworte:
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