Method and system for removing thin metal film

A system for removing a thin metal film comprising an inclining metal plate electrode (21) for guiding a downward electrolyte flow, an auxiliary electrode (22) placed on the upstream or downstream side of the metal plate electrode (21) such that a part of the auxiliary electrode is immersed into the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: INOUE, TETSUYA+, DAIKU, HIROYUKI, HAMADA, SHOGO, TSUKAHARA, MASANORI, MAEHATA, HIDEHIKO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator INOUE, TETSUYA+
DAIKU, HIROYUKI
HAMADA, SHOGO
TSUKAHARA, MASANORI
MAEHATA, HIDEHIKO
description A system for removing a thin metal film comprising an inclining metal plate electrode (21) for guiding a downward electrolyte flow, an auxiliary electrode (22) placed on the upstream or downstream side of the metal plate electrode (21) such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply (23) for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film (24a) on the surface of an insulator (24) by making the electrolyte (26) flowing down the metal plate electrode (21) strike against the metal thin film (24a) under a state where the DC voltage is applied to the metal plate electrode (21) and the auxiliary electrode (22).
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI274616BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI274616BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI274616BB3</originalsourceid><addsrcrecordid>eNrjZNDzTS3JyE9RSMxLUSiuLC5JzVVIyy9SKErNzS_LzEtXKMnIzFPITS1JzFFIy8zJ5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8SHhnkbmJmaGZk5OxkQoAQCaySpo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method and system for removing thin metal film</title><source>esp@cenet</source><creator>INOUE, TETSUYA+ ; DAIKU, HIROYUKI ; HAMADA, SHOGO ; TSUKAHARA, MASANORI ; MAEHATA, HIDEHIKO</creator><creatorcontrib>INOUE, TETSUYA+ ; DAIKU, HIROYUKI ; HAMADA, SHOGO ; TSUKAHARA, MASANORI ; MAEHATA, HIDEHIKO</creatorcontrib><description>A system for removing a thin metal film comprising an inclining metal plate electrode (21) for guiding a downward electrolyte flow, an auxiliary electrode (22) placed on the upstream or downstream side of the metal plate electrode (21) such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply (23) for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film (24a) on the surface of an insulator (24) by making the electrolyte (26) flowing down the metal plate electrode (21) strike against the metal thin film (24a) under a state where the DC voltage is applied to the metal plate electrode (21) and the auxiliary electrode (22).</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS ; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL ; TRANSPORTING ; WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070301&amp;DB=EPODOC&amp;CC=TW&amp;NR=I274616B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070301&amp;DB=EPODOC&amp;CC=TW&amp;NR=I274616B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>INOUE, TETSUYA+</creatorcontrib><creatorcontrib>DAIKU, HIROYUKI</creatorcontrib><creatorcontrib>HAMADA, SHOGO</creatorcontrib><creatorcontrib>TSUKAHARA, MASANORI</creatorcontrib><creatorcontrib>MAEHATA, HIDEHIKO</creatorcontrib><title>Method and system for removing thin metal film</title><description>A system for removing a thin metal film comprising an inclining metal plate electrode (21) for guiding a downward electrolyte flow, an auxiliary electrode (22) placed on the upstream or downstream side of the metal plate electrode (21) such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply (23) for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film (24a) on the surface of an insulator (24) by making the electrolyte (26) flowing down the metal plate electrode (21) strike against the metal thin film (24a) under a state where the DC voltage is applied to the metal plate electrode (21) and the auxiliary electrode (22).</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</subject><subject>SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL</subject><subject>TRANSPORTING</subject><subject>WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDzTS3JyE9RSMxLUSiuLC5JzVVIyy9SKErNzS_LzEtXKMnIzFPITS1JzFFIy8zJ5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8SHhnkbmJmaGZk5OxkQoAQCaySpo</recordid><startdate>20070301</startdate><enddate>20070301</enddate><creator>INOUE, TETSUYA+</creator><creator>DAIKU, HIROYUKI</creator><creator>HAMADA, SHOGO</creator><creator>TSUKAHARA, MASANORI</creator><creator>MAEHATA, HIDEHIKO</creator><scope>EVB</scope></search><sort><creationdate>20070301</creationdate><title>Method and system for removing thin metal film</title><author>INOUE, TETSUYA+ ; DAIKU, HIROYUKI ; HAMADA, SHOGO ; TSUKAHARA, MASANORI ; MAEHATA, HIDEHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI274616BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</topic><topic>SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL</topic><topic>TRANSPORTING</topic><topic>WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL</topic><toplevel>online_resources</toplevel><creatorcontrib>INOUE, TETSUYA+</creatorcontrib><creatorcontrib>DAIKU, HIROYUKI</creatorcontrib><creatorcontrib>HAMADA, SHOGO</creatorcontrib><creatorcontrib>TSUKAHARA, MASANORI</creatorcontrib><creatorcontrib>MAEHATA, HIDEHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>INOUE, TETSUYA+</au><au>DAIKU, HIROYUKI</au><au>HAMADA, SHOGO</au><au>TSUKAHARA, MASANORI</au><au>MAEHATA, HIDEHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and system for removing thin metal film</title><date>2007-03-01</date><risdate>2007</risdate><abstract>A system for removing a thin metal film comprising an inclining metal plate electrode (21) for guiding a downward electrolyte flow, an auxiliary electrode (22) placed on the upstream or downstream side of the metal plate electrode (21) such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply (23) for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film (24a) on the surface of an insulator (24) by making the electrolyte (26) flowing down the metal plate electrode (21) strike against the metal thin film (24a) under a state where the DC voltage is applied to the metal plate electrode (21) and the auxiliary electrode (22).</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_TWI274616BB
source esp@cenet
subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS
SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
TRANSPORTING
WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL
title Method and system for removing thin metal film
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T15%3A46%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=INOUE,%20TETSUYA+&rft.date=2007-03-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI274616BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true