Method and system for removing thin metal film

A system for removing a thin metal film comprising an inclining metal plate electrode (21) for guiding a downward electrolyte flow, an auxiliary electrode (22) placed on the upstream or downstream side of the metal plate electrode (21) such that a part of the auxiliary electrode is immersed into the...

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Bibliographische Detailangaben
Hauptverfasser: INOUE, TETSUYA+, DAIKU, HIROYUKI, HAMADA, SHOGO, TSUKAHARA, MASANORI, MAEHATA, HIDEHIKO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A system for removing a thin metal film comprising an inclining metal plate electrode (21) for guiding a downward electrolyte flow, an auxiliary electrode (22) placed on the upstream or downstream side of the metal plate electrode (21) such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply (23) for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film (24a) on the surface of an insulator (24) by making the electrolyte (26) flowing down the metal plate electrode (21) strike against the metal thin film (24a) under a state where the DC voltage is applied to the metal plate electrode (21) and the auxiliary electrode (22).