Semiconductor apparatus

A kind of semiconductor device restrains the temperature rising of wiring pattern after main current passed and the rising of component cost. There are a copper pattern 33 formed on the insulated circuit substrate 32, a heat spreader 34 welded on copper pattern 33, and a semiconductor chip 35 instal...

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Hauptverfasser: AKAGAWA, KOICHI, ISHIKAWA, JUN, ONISHI, HIROYUKI, NAGASE, TOSHIAKI
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creator AKAGAWA, KOICHI
ISHIKAWA, JUN
ONISHI, HIROYUKI
NAGASE, TOSHIAKI
description A kind of semiconductor device restrains the temperature rising of wiring pattern after main current passed and the rising of component cost. There are a copper pattern 33 formed on the insulated circuit substrate 32, a heat spreader 34 welded on copper pattern 33, and a semiconductor chip 35 installed on heat spreader 34 to make the distance a between the side 36a of outer electrode 36 and side 34a of heat spreader 34 in a shorter form to install outer electrode 36 and heat spreader 34. Thereby, it can restrain the temperature rising of copper pattern 33 between side 36a of outer electrode 36 and side 34a of heat spreader 34.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor apparatus
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