Multi-stage low noise integrated object and system cooling solution

Multi-stage low noise integrated object and system cooling solution

A method and system are described for multi-stage cooling of a system, such as a computer system, and a high thermal dissipating object, such as a CPU, to minimize acoustic noise generated by the cooling system. The method includes causing at least one fan in a system to operate at high speeds durin...

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1. Verfasser: NELSON, DARYL
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
CONTROLLING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
REGULATING
SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
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creator NELSON, DARYL
description A method and system are described for multi-stage cooling of a system, such as a computer system, and a high thermal dissipating object, such as a CPU, to minimize acoustic noise generated by the cooling system. The method includes causing at least one fan in a system to operate at high speeds during a first stage, and reducing the speed of at least one fan during an intermediary stage. The system includes a high thermal dissipating object, a heat sink connected to the high thermal dissipating object, a first fan to direct airflow on a main section of a heat sink during a first stage, and a second fan to direct airflow on an extended section of the heat sink. Optionally, a final stage may be entered into where all fans are shut off.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI243638BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI243638BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI243638BB3</originalsourceid><addsrcrecordid>eNqNyjEKwkAQBdBtLES9w1wgjStinaCYwi5gGdbNd9mwzoTMBPH2Nh7A6jVv7ZrbUixXaiGBiryJJSsosyHNwTCQPEZEo8AD6UcNL4oiJXMilbJYFt661TMUxe7nxtHl3DXXCpP00ClEMKzv7u3-4I_-VNf-j_IFRvIy4g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Multi-stage low noise integrated object and system cooling solution</title><source>esp@cenet</source><creator>NELSON, DARYL</creator><creatorcontrib>NELSON, DARYL</creatorcontrib><description>A method and system are described for multi-stage cooling of a system, such as a computer system, and a high thermal dissipating object, such as a CPU, to minimize acoustic noise generated by the cooling system. The method includes causing at least one fan in a system to operate at high speeds during a first stage, and reducing the speed of at least one fan during an intermediary stage. The system includes a high thermal dissipating object, a heat sink connected to the high thermal dissipating object, a first fan to direct airflow on a main section of a heat sink during a first stage, and a second fan to direct airflow on an extended section of the heat sink. Optionally, a final stage may be entered into where all fans are shut off.</description><edition>7</edition><language>eng</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; CONTROLLING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; REGULATING ; SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20051111&amp;DB=EPODOC&amp;CC=TW&amp;NR=I243638B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20051111&amp;DB=EPODOC&amp;CC=TW&amp;NR=I243638B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NELSON, DARYL</creatorcontrib><title>Multi-stage low noise integrated object and system cooling solution</title><description>A method and system are described for multi-stage cooling of a system, such as a computer system, and a high thermal dissipating object, such as a CPU, to minimize acoustic noise generated by the cooling system. The method includes causing at least one fan in a system to operate at high speeds during a first stage, and reducing the speed of at least one fan during an intermediary stage. The system includes a high thermal dissipating object, a heat sink connected to the high thermal dissipating object, a first fan to direct airflow on a main section of a heat sink during a first stage, and a second fan to direct airflow on an extended section of the heat sink. Optionally, a final stage may be entered into where all fans are shut off.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>CONTROLLING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>REGULATING</subject><subject>SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEKwkAQBdBtLES9w1wgjStinaCYwi5gGdbNd9mwzoTMBPH2Nh7A6jVv7ZrbUixXaiGBiryJJSsosyHNwTCQPEZEo8AD6UcNL4oiJXMilbJYFt661TMUxe7nxtHl3DXXCpP00ClEMKzv7u3-4I_-VNf-j_IFRvIy4g</recordid><startdate>20051111</startdate><enddate>20051111</enddate><creator>NELSON, DARYL</creator><scope>EVB</scope></search><sort><creationdate>20051111</creationdate><title>Multi-stage low noise integrated object and system cooling solution</title><author>NELSON, DARYL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI243638BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>CONTROLLING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>REGULATING</topic><topic>SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES</topic><toplevel>online_resources</toplevel><creatorcontrib>NELSON, DARYL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NELSON, DARYL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Multi-stage low noise integrated object and system cooling solution</title><date>2005-11-11</date><risdate>2005</risdate><abstract>A method and system are described for multi-stage cooling of a system, such as a computer system, and a high thermal dissipating object, such as a CPU, to minimize acoustic noise generated by the cooling system. The method includes causing at least one fan in a system to operate at high speeds during a first stage, and reducing the speed of at least one fan during an intermediary stage. The system includes a high thermal dissipating object, a heat sink connected to the high thermal dissipating object, a first fan to direct airflow on a main section of a heat sink during a first stage, and a second fan to direct airflow on an extended section of the heat sink. Optionally, a final stage may be entered into where all fans are shut off.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
CONTROLLING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
REGULATING
SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
title Multi-stage low noise integrated object and system cooling solution
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T22%3A34%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NELSON,%20DARYL&rft.date=2005-11-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI243638BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true