Die carrier
A die carrier 2 has a body 29 with a primary surface 295 adapted for attachment to a substrate die 31. The body 29 at least partially defines a fluid chamber 23. A fill port 21 and an evacuate port are each fluidically connected to the fluid chamber 23.
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| creator | HELLEKSON, RONALD A SMITH, JOSHUA W CRAIG, DAVID M. BOUCHER, WILLIAM R CHEN, CHIEN-HUA |
| description | A die carrier 2 has a body 29 with a primary surface 295 adapted for attachment to a substrate die 31. The body 29 at least partially defines a fluid chamber 23. A fill port 21 and an evacuate port are each fluidically connected to the fluid chamber 23. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI239068BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI239068BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI239068BB3</originalsourceid><addsrcrecordid>eNrjZOB2yUxVSE4sKspMLeJhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfEh4Z5GxpYGZhZOTsZEKAEAooMdLg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Die carrier</title><source>esp@cenet</source><creator>HELLEKSON, RONALD A ; SMITH, JOSHUA W ; CRAIG, DAVID M. ; BOUCHER, WILLIAM R ; CHEN, CHIEN-HUA</creator><creatorcontrib>HELLEKSON, RONALD A ; SMITH, JOSHUA W ; CRAIG, DAVID M. ; BOUCHER, WILLIAM R ; CHEN, CHIEN-HUA</creatorcontrib><description>A die carrier 2 has a body 29 with a primary surface 295 adapted for attachment to a substrate die 31. The body 29 at least partially defines a fluid chamber 23. A fill port 21 and an evacuate port are each fluidically connected to the fluid chamber 23.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050901&DB=EPODOC&CC=TW&NR=I239068B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050901&DB=EPODOC&CC=TW&NR=I239068B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HELLEKSON, RONALD A</creatorcontrib><creatorcontrib>SMITH, JOSHUA W</creatorcontrib><creatorcontrib>CRAIG, DAVID M.</creatorcontrib><creatorcontrib>BOUCHER, WILLIAM R</creatorcontrib><creatorcontrib>CHEN, CHIEN-HUA</creatorcontrib><title>Die carrier</title><description>A die carrier 2 has a body 29 with a primary surface 295 adapted for attachment to a substrate die 31. The body 29 at least partially defines a fluid chamber 23. A fill port 21 and an evacuate port are each fluidically connected to the fluid chamber 23.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOB2yUxVSE4sKspMLeJhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfEh4Z5GxpYGZhZOTsZEKAEAooMdLg</recordid><startdate>20050901</startdate><enddate>20050901</enddate><creator>HELLEKSON, RONALD A</creator><creator>SMITH, JOSHUA W</creator><creator>CRAIG, DAVID M.</creator><creator>BOUCHER, WILLIAM R</creator><creator>CHEN, CHIEN-HUA</creator><scope>EVB</scope></search><sort><creationdate>20050901</creationdate><title>Die carrier</title><author>HELLEKSON, RONALD A ; SMITH, JOSHUA W ; CRAIG, DAVID M. ; BOUCHER, WILLIAM R ; CHEN, CHIEN-HUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI239068BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HELLEKSON, RONALD A</creatorcontrib><creatorcontrib>SMITH, JOSHUA W</creatorcontrib><creatorcontrib>CRAIG, DAVID M.</creatorcontrib><creatorcontrib>BOUCHER, WILLIAM R</creatorcontrib><creatorcontrib>CHEN, CHIEN-HUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HELLEKSON, RONALD A</au><au>SMITH, JOSHUA W</au><au>CRAIG, DAVID M.</au><au>BOUCHER, WILLIAM R</au><au>CHEN, CHIEN-HUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Die carrier</title><date>2005-09-01</date><risdate>2005</risdate><abstract>A die carrier 2 has a body 29 with a primary surface 295 adapted for attachment to a substrate die 31. The body 29 at least partially defines a fluid chamber 23. A fill port 21 and an evacuate port are each fluidically connected to the fluid chamber 23.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Die carrier |
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