A heat-spreader mounter applied for IC assembly

A heat-spreader mounter applied for IC assembly

A heat-spreader mounter for IC assembly includes a pick and put head to picks/puts a heat-spreader and a board supporter located under the pick and put head to support a board. Whenever the pick and put head picks a heat-spreader to put on a board supported by the board supporter, tips of the board...

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Hauptverfasser: YANG, JUNGI, LIN, JIUN-SHIUNG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator YANG, JUNGI
LIN, JIUN-SHIUNG
description A heat-spreader mounter for IC assembly includes a pick and put head to picks/puts a heat-spreader and a board supporter located under the pick and put head to support a board. Whenever the pick and put head picks a heat-spreader to put on a board supported by the board supporter, tips of the board supporter can limit the height of the pick and put head moves near closely to the board. And when the pick and put head moves and touches the tips, a connecting neck of the pick and put head deforms to make a nozzle of the pick and put head tilt to keep the picking heat-spreader being parallel to the board mounts on the board.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title A heat-spreader mounter applied for IC assembly
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