Structure of metal barrier structure on conductive structure and method of forming the same

The present invention provides a method for forming a metal barrier structure on the metal layer of a conductive structure, and the metal layer is provided with a rough surface. Before forming the metal barrier structure on the rough surface of the metal layer, an additional conductive metal layer i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WEN, SHAUOU, CHANG, KAII, SU, KUN-SHAN, HORNG, CHING-FU
Format: Patent
Sprache:eng
Schlagworte:
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