Structure of metal barrier structure on conductive structure and method of forming the same

The present invention provides a method for forming a metal barrier structure on the metal layer of a conductive structure, and the metal layer is provided with a rough surface. Before forming the metal barrier structure on the rough surface of the metal layer, an additional conductive metal layer i...

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Hauptverfasser: WEN, SHAUOU, CHANG, KAII, SU, KUN-SHAN, HORNG, CHING-FU
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creator WEN, SHAUOU
CHANG, KAII
SU, KUN-SHAN
HORNG, CHING-FU
description The present invention provides a method for forming a metal barrier structure on the metal layer of a conductive structure, and the metal layer is provided with a rough surface. Before forming the metal barrier structure on the rough surface of the metal layer, an additional conductive metal layer is utilized to cover the rough surface and to provide a smooth base for the metal barrier. Hence, the metal barrier structure will have a smooth surface and a reliable connection with other conductive elements could be achieved.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Structure of metal barrier structure on conductive structure and method of forming the same
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