Structure of metal barrier structure on conductive structure and method of forming the same
The present invention provides a method for forming a metal barrier structure on the metal layer of a conductive structure, and the metal layer is provided with a rough surface. Before forming the metal barrier structure on the rough surface of the metal layer, an additional conductive metal layer i...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention provides a method for forming a metal barrier structure on the metal layer of a conductive structure, and the metal layer is provided with a rough surface. Before forming the metal barrier structure on the rough surface of the metal layer, an additional conductive metal layer is utilized to cover the rough surface and to provide a smooth base for the metal barrier. Hence, the metal barrier structure will have a smooth surface and a reliable connection with other conductive elements could be achieved. |
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