High heat dissipation micro package of semiconductor chip

This invention relates to a high heat dissipation micro package, which mainly comprises: a copper alloy leadframe which is etched to form a recess chip pad platform, in which there are hollowed-out slots installed at the surrounding of the platform with several supporting strips connecting to the le...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANG, CHIA-MING, LIANG, SHU-FEN, HSIEH, YAN-SHU, CHOU, SHU-MIN, SHIE, WEN-LE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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