High heat dissipation micro package of semiconductor chip

This invention relates to a high heat dissipation micro package, which mainly comprises: a copper alloy leadframe which is etched to form a recess chip pad platform, in which there are hollowed-out slots installed at the surrounding of the platform with several supporting strips connecting to the leadframe main body; a substrate with pins manufactured corresponding to hollowed-out slot positions of the leadframe to be bonded with gold wires for achieving high pin count; and a chip, which is normally bonded onto the chip pad of the leadframe using a bonding agent, in which gold wire is applied onto the reserved electrical bonding pins between the chip and the substrate by wiring technique to achieve function output purpose and heat generated during chip operation can be dissipated from the chip pad by conducting to other region of the leadframe through the supporting strips to achieve high heat dissipation. According to the abovementioned structure, the leadframe is bonded with the substrate, the chip is bonded onto the chip pad of the leadframe, the wiring technique is employed to conduct between the chip pin pad and the substrate with gold wire, and finally an encapsulation resin is used to fill the hollowed-out slots and cover a portion of the surface area of the gold wire and the leadframe to form a package.