In-situ detection of thin-metal interface using optical interference via a dynamically updated reference

An invention for detecting an endpoint during a chemical mechanical polishing (CMP) process is provided. A reflected spectrum data sample is received that corresponds to a plurality of spectrums of light reflected from an illuminated portion of the surface of a wafer. The reflected spectrum data sam...

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1. Verfasser:	AMARTUR, SUNDAR
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DETECTING MASSES OR OBJECTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GEOPHYSICS GRAVITATIONAL MEASUREMENTS MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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