Method for manufacturing personal digital assistant
A method for manufacturing a personal digital assistant (PDA). The personal digital assistant has an upper housing and a lower housing. The method includes following steps: (a) using a plastic ejection mold to eject a first portion and a second portion of the upper housing, and eject a plurality of...
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| creator | CHIU, CHANG-HUANG LEE, CHUN-SHIH |
| description | A method for manufacturing a personal digital assistant (PDA). The personal digital assistant has an upper housing and a lower housing. The method includes following steps: (a) using a plastic ejection mold to eject a first portion and a second portion of the upper housing, and eject a plurality of positioning studs on an inner side of the upper housing. The first portion of the upper housing can be electroplated, and the second portion of the upper housing cannot be electroplated. Moreover, the positioning studs can be electroplated. (b) After performing step (a), electroplating the upper housing so as to form conductive layers on the first portion of the upper housing and on the positioning studs. |
| format | Patent |
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The method includes following steps: (a) using a plastic ejection mold to eject a first portion and a second portion of the upper housing, and eject a plurality of positioning studs on an inner side of the upper housing. The first portion of the upper housing can be electroplated, and the second portion of the upper housing cannot be electroplated. Moreover, the positioning studs can be electroplated. (b) After performing step (a), electroplating the upper housing so as to form conductive layers on the first portion of the upper housing and on the positioning studs.</description><edition>7</edition><language>eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040901&DB=EPODOC&CC=TW&NR=I220703B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040901&DB=EPODOC&CC=TW&NR=I220703B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHIU, CHANG-HUANG</creatorcontrib><creatorcontrib>LEE, CHUN-SHIH</creatorcontrib><title>Method for manufacturing personal digital assistant</title><description>A method for manufacturing a personal digital assistant (PDA). 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(b) After performing step (a), electroplating the upper housing so as to form conductive layers on the first portion of the upper housing and on the positioning studs.</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD2TS3JyE9RSMsvUshNzCtNS0wuKS3KzEtXKEgtKs7PS8xRSMlMzywB0onFxZnFJYl5JTwMrGmJOcWpvFCam0HBzTXE2UM3tSA_PrW4IDE5NS-1JD4k3NPIyMDcwNjJyZgIJQDodiz4</recordid><startdate>20040901</startdate><enddate>20040901</enddate><creator>CHIU, CHANG-HUANG</creator><creator>LEE, CHUN-SHIH</creator><scope>EVB</scope></search><sort><creationdate>20040901</creationdate><title>Method for manufacturing personal digital assistant</title><author>CHIU, CHANG-HUANG ; LEE, CHUN-SHIH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI220703BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHIU, CHANG-HUANG</creatorcontrib><creatorcontrib>LEE, CHUN-SHIH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHIU, CHANG-HUANG</au><au>LEE, CHUN-SHIH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for manufacturing personal digital assistant</title><date>2004-09-01</date><risdate>2004</risdate><abstract>A method for manufacturing a personal digital assistant (PDA). The personal digital assistant has an upper housing and a lower housing. The method includes following steps: (a) using a plastic ejection mold to eject a first portion and a second portion of the upper housing, and eject a plurality of positioning studs on an inner side of the upper housing. The first portion of the upper housing can be electroplated, and the second portion of the upper housing cannot be electroplated. Moreover, the positioning studs can be electroplated. (b) After performing step (a), electroplating the upper housing so as to form conductive layers on the first portion of the upper housing and on the positioning studs.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | Method for manufacturing personal digital assistant |
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