In-situ detection of thin-metal interface using optical interference

An invention is disclosed for an optical endpoint detection system that utilizes optical interference to determine when a metal layer has reached a thin metal zone during a CMP process. A portion of a surface of a wafer is illuminated with broad band light source. Then, reflected spectrum data corre...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	AMARTUR, SUNDAR
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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